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PLASMA APPARATUS WITH DEVICE FOR REDUCING POLYMER DEPOSITION ON A SUBSTRATE AND METHOD FOR REDUCING POLYMER DEPOSITION
PLASMA APPARATUS WITH DEVICE FOR REDUCING POLYMER DEPOSITION ON A SUBSTRATE AND METHOD FOR REDUCING POLYMER DEPOSITION
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机译:具有用于减少基材上聚合物沉积的装置的等离子体装置以及用于降低聚合物沉积的方法
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摘要
The adjustable RF coupling ring is to reduce the vertical clearance between the substrate and the hot edge ring in a vacuum processing chamber, can . The reduction of the gap reduces the polymer deposited on the substrate and the electrostatic chuck improves wafer processing .
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