首页> 外国专利> Tool, especially a cutting tool, comprising a substrate member onto which at least one layer is deposited by means of chemical vapor deposition (CVD) used in machining operations, e.g. metal cutting

Tool, especially a cutting tool, comprising a substrate member onto which at least one layer is deposited by means of chemical vapor deposition (CVD) used in machining operations, e.g. metal cutting

机译:工具,特别是切削工具,包括基底构件,在该基底构件上通过例如在加工操作中使用的化学气相沉积(CVD)沉积至少一层。金属切割

摘要

Tool, especially a cutting tool comprises a substrate member onto which at least one layer is deposited by means of chemical vapor deposition (CVD), and a method for CVD of a two-phase layer on a sintered part. The individual deposited layers or at least one of them contain TiCN-, TiOCN-, TiOC-, or TiC phases and an additional ZrO 2 and/or HfO 2 phase. An independent claim is included for CVD of a two-phase layer in a gas atmosphere containing TiCl 4, HfCl 4 and/or ZrCl 4 and CO 2, acetonitrile, pyridine, or benzene, remainder hydrogen and/or argon.
机译:工具,尤其是切削工具,包括:基底构件,通过化学气相沉积(CVD)在其上沉积至少一层;以及用于在烧结部件上CVD两相层的方法。各个沉积层或它们中的至少一层包含TiCN-,TiOCN-,TiOC-或TiC相以及另外的ZrO 2和/或HfO 2相。对于在包含TiCl 4,HfCl 4和/或ZrCl 4和CO 2,乙腈,吡啶或苯,剩余氢和/或氩气的气体气氛中对两相层的CVD包括独立权利要求。

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