Method for producing a light-emitting diode using metal substrate and metal adhesive technology and structure of this

摘要

A method of manufacturing the light emitting diode using the metal substrate and the metal adhesive technology will be described. The method comprises the steps of providing a growth substrate (10), forming a multilayer semiconductor structure (1) on the growth substrate (10), bonding a metal substrate (13) to the multilayer semiconductor structure (11), Removing the growth substrate (10) and forming a first electrode and a second electrode respectively on the multi-layered semiconductor structure (11) and the metal substrate (13).