首页> 外国专利> Electrical housing esp. for opto-electronic circuits, has thermally active priming layer placed between housing material and finishing layer

Electrical housing esp. for opto-electronic circuits, has thermally active priming layer placed between housing material and finishing layer

机译:电气外壳,特别是用于光电电路,在外壳材料和精加工层之间放置了热活性底漆层

摘要

A housing for accommodating electrical circuitry, especially for opto-electronic circuits is completely or partly provided with an electrically insulating high-crosslinking organic coating as a finishing layer. A thermally active electrically conductive priming layer is placed between the housing material and the finishing layer.
机译:用于容纳电路,特别是用于光电电路的壳体完全或部分地具有电绝缘的高交联有机涂层作为装饰层。导热导电底涂层放置在壳体材料和表面层之间。

著录项

  • 公开/公告号DE202005005938U1

    专利类型

  • 公开/公告日2005-08-11

    原文格式PDF

  • 申请/专利权人 VISOLUX ZWEIGNIEDERLASSUNG DER;

    申请/专利号DE20052005938U

  • 发明设计人

    申请日2005-04-09

  • 分类号H05K5/02;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:15

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