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Susceptibility of Multilayer Printed Circuit inside Equipment Housing

机译:设备外壳内部多层印刷电路的敏感性

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摘要

This paper deals with the electromagnetic field analysis of susceptibility of multilayer printed circuit inside equipment housing. The analysis is based on two EM analysis methods, that is, the method of moments and the transmission-line modeling method. These algorithms provide many informations useful for evaluating the susceptibility of the circuit to the electromagnetic field penetrating into the housing through a narrow slot, and also that coupled to the circuit through a cable led into the housing.
机译:本文对设备壳体内部多层印刷电路的磁化率进行电磁场分析。该分析基于两种电磁分析方法,即矩量法和传输线建模法。这些算法提供了许多有用的信息,这些信息可用于评估电路对通过狭窄狭槽进入外壳的电磁场的敏感性,以及通过引入外壳的电缆与电路耦合的电磁场的敏感性。

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