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Susceptibility of Multilayer Printed Circuit inside Equipment Housing

机译:多层印刷电路内部设备外壳的易感性

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This paper deals with the electromagnetic field analysis of susceptibility of multilayer printed circuit inside equipment housing. The analysis is based on two EM analysis methods, that is, the method of moments and the transmission-line modeling method. These algorithms provide many informations useful for evaluating the susceptibility of the circuit to the electromagnetic field penetrating into the housing through a narrow slot, and also that coupled to the circuit through a cable led into the housing.
机译:本文涉及设备外壳内部印刷电路易感性的电磁场分析。分析基于两个EM分析方法,即矩和传输线材建模方法的方法。这些算法提供了许多可用于评估电路通过窄槽进入壳体的电磁场的易感性的信息,并且还通过LED耦合到壳体的电缆连接到电路。

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