首页> 外国专利> NON-CONDUCTIVE METAL GLOSS PLATING, CASE FOR ELECTRONIC DEVICE WITH NON-CONDUCTIVE METAL GLOSS PLATING, AND METHOD OF FORMING NON-CONDUCTIVE METAL GLASS PLATING

NON-CONDUCTIVE METAL GLOSS PLATING, CASE FOR ELECTRONIC DEVICE WITH NON-CONDUCTIVE METAL GLOSS PLATING, AND METHOD OF FORMING NON-CONDUCTIVE METAL GLASS PLATING

机译:非导电金属玻璃镀层,用于具有非导电金属玻璃镀层的电子设备的情况以及形成非导电金属玻璃镀层的方法

摘要

PROBLEM TO BE SOLVED: To provide a non-conductive metal gloss plating and a method of forming the non-conductive metal gloss plating which are effective as a remedy against the electrostatic breakdown of a resin-made plate or a resin-made case.;SOLUTION: The non-conductive metal glass plating has a constitution comprising a first resin coating layer formed on the surface of a substrate to be coated by application and drying, a non-conductive metal vapor deposition film having a metallic luster and being extremely thin obtained by heating an alloy including a tin or a tin and an indium in vacuum and performing a vacuum deposition onto the first resin film coating layer on the above substrate, and a second resin film layer formed by the application and drying on the above non-conductive metal vapor deposition film. Since the above deposition is stopped before the grains of the above tin or alloy of tin and indium form a continuous metal film on the above first resin coating film layer, the above metal vapor deposition film becomes non-conductive and the static electricity does not pass through the surface though it has metallic luster, and does not have an electromagnetic shielding action.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种不导电的金属光泽镀层和形成该不导电的金属光泽镀层的方法,该方法有效地抵抗了树脂制板或树脂制壳体的静电击穿。解决方案:非导电金属玻璃镀层的结构包括:通过涂覆和干燥在要涂覆的基材表面上形成第一树脂涂层;获得具有金属光泽且极薄的非导电金属气相沉积膜通过在真空中加热包含锡或锡和铟的合金,并在上述基板上的第一树脂膜涂层上进行真空沉积,并在上述非导电性上涂布并干燥形成第二树脂膜层金属气相沉积膜。由于在上述锡的晶粒或锡与铟的合金的晶粒在上述第一树脂涂膜层上形成连续的金属膜之前停止了上述沉积,所以上述金属气相沉积膜变得不导电并且静电不通过具有金属光泽,并且没有电磁屏蔽作用。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2006281726A

    专利类型

  • 公开/公告日2006-10-19

    原文格式PDF

  • 申请/专利权人 MANNEN:KK;DYNATEC KK;

    申请/专利号JP20050108443

  • 发明设计人 NAKAJIMA TAKASHI;HIRAKATA MASAHIDE;

    申请日2005-04-05

  • 分类号B32B15/08;B05D3/10;B05D5/06;C23C14/14;C23C14/20;

  • 国家 JP

  • 入库时间 2022-08-21 21:57:15

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