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PRESSURE GRADIENT ION PLATING TYPE FILM DEPOSITION SYSTEM AND FILM DEPOSITION METHOD

机译:压力梯度离子镀式成膜系统及成膜方法

摘要

PROBLEM TO BE SOLVED: To provide a vacuum film deposition system and a vacuum film deposition method using a pressure gradient ion plating process capable of corresponding even to the case that an electrically insulating substance is film-deposited, capable of sufficiently stably depositing a film on a base material as an object, and also capable of obtaining a stably film-deposited base material.;SOLUTION: In the vacuum film deposition system, a pressure gradient hollow cathode type ion plating film deposition part having a pressure gradient plasma gun is provided, and a thin film is deposited on one side of a base material in the film deposition part by an ion plating process, a plasma confining part of forming a discharge plasma-confined space so as to be contacted with the surface of the base material to be film-deposited is provided.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种使用压力梯度离子镀工艺的真空膜沉积系统和真空膜沉积方法,其能够甚至对应于沉积电绝缘物质的情况,并且能够在其上充分稳定地沉积膜。解决方案:在真空成膜系统中,提供具有压力梯度等离子体枪的压力梯度中空阴极型离子镀膜沉积部分,并且,在上述成膜部中,通过离子镀法在基材的一面形成薄膜,该等离子体限制部形成放电等离子体约束空间,并与基材的表面接触。提供胶卷;版权所有:(C)2006,日本特许厅&日本电影院

著录项

  • 公开/公告号JP2006118031A

    专利类型

  • 公开/公告日2006-05-11

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20040309887

  • 发明设计人 KOMADA MINORU;

    申请日2004-10-25

  • 分类号C23C14/32;

  • 国家 JP

  • 入库时间 2022-08-21 21:56:41

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