首页> 外国专利> METHOD FOR SUPPLYING SOLDER PASTE TO PRINTER AND BLIND CYLINDRICAL CONTAINER FOR SOLDER PASTE

METHOD FOR SUPPLYING SOLDER PASTE TO PRINTER AND BLIND CYLINDRICAL CONTAINER FOR SOLDER PASTE

机译:一种向印刷机供应焊膏的方法以及用于焊膏的盲圆柱容器

摘要

PROBLEM TO BE SOLVED: To provide a supply method capable of preventing soldering defects, facilitating agitation and uniformly agitating solder paste inside a container in a short time, and the container for the solder paste.;SOLUTION: The solder paste of an amount suitable for the time of the initial operation of a printer is put in the container, the whole amount is supplied in the initial period of printing, and a half amount is supplied at the time of addition. Also, for a cylindrical container for the solder paste, an air gap becomes 20-40 vol.% when the solder paste is put in with the amount suitable for the time of the initial operation of the printer.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种能够在短时间内防止锡焊缺陷,促进搅拌并在容器内均匀搅拌锡膏的供应方法,以及用于锡膏的容器。将打印机的初始操作时间放入容器中,在打印的初始阶段提供全部数量,在添加时提供一半的数量。同样,对于用于焊膏的圆柱形容器,当焊膏的加入量适合于打印机的初始操作时间时,气隙将变为20-40 vol。%。版权所有:(C)2006 ,JPO&NCIPI

著录项

  • 公开/公告号JP2006216872A

    专利类型

  • 公开/公告日2006-08-17

    原文格式PDF

  • 申请/专利权人 SENJU METAL IND CO LTD;

    申请/专利号JP20050030000

  • 申请日2005-02-07

  • 分类号H05K3/34;B23K3/06;B41F15/08;B41F15/40;B41M1/12;

  • 国家 JP

  • 入库时间 2022-08-21 21:56:22

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