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PASSIVE ELEMENT, PASSIVE DEVICE, IC (INTEGRATED CIRCUIT) CHIP, OSCILLATOR, AND MANUFACTURING METHOD OF ALL

机译:无源元件,无源器件,IC(集成电路)芯片,振荡器和全部制造方法

摘要

PROBLEM TO BE SOLVED: To provide a passive element capable of taking the effective area SE of an electrode so as to be larger than before, an IC chip as well as an oscillator equipped with the passive element, and the manufacturing method thereof.;SOLUTION: In the passive element 1 equipped with a wafer 2, a lower electrode 4 formed on the wafer 2 through a first insulating film 3, a capacity film 5 formed on the lower electrode 4, and an upper electrode 6 formed on the capacity film 5; the configuration of the lower electrode 6, the same of the capacity film 5 and the same of the upper electrode 6 are hexagonal.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:要解决的问题:提供一种能够使电极的有效面积S E 变得比以前更大的无源元件,IC芯片以及配备有该无源元件的振荡器,解决方案:在配备有晶片2的无源元件1中,通过第一绝缘膜3在晶片2上形成的下部电极4,在下部电极4上形成的电容膜5和上部电极6形成在电容膜5上。下部电极6的结构与容量膜5相同,上部电极6为六边形。版权所有(C)2006,日本特许厅

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