ORGANIC PROTECTIVE FILM, FILM FORMING METHOD OF ORGANIC PROTECTION, AND ELECTRICAL DEVICE WITH ORGANIC PROTECTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide an organic protective film for adherends such as a device and a circuit board or the like which can assure sufficient insulation and reliability in chemical resistance without an enlargement and complication of a film forming apparatus and after attaining the reduction of electric power consumption furthermore.;SOLUTION: The organic protective sheet comprises: polymonochloro-p-xylylene and/or polydichloro-p-xylylene; poly-p-xylylene; and a single layer film having chemical resistance and insulation which is formed on the surface of the adherend, wherein this single layer sheet has a high composition ratio of the polymonochloro-p-xylylene and/or polydichloro-p-xylylene in the underlayer domain of the mating surface with the adherend and has a high composition ratio of the poly-p-xylylene in the upper-layer domain of a film surface side. In addition, its manufacturing method and the adherend with the organic protective film are provided.;COPYRIGHT: (C)2006,JPO&NCIPI