THICK-FILM CAPACITOR, EMBEDDED TYPE THICK-FILM CAPACITOR INSIDE PRINTED CIRCUIT BOARD, AND METHODS FOR FORMING THE SAME AND PRINTED CIRCUIT BOARD

摘要

PPROBLEM TO BE SOLVED: To provide a capacitor free from the damage of a dielectric lay by an etching solution and a manufacturing method of a printed circuit board including the same. PSOLUTION: This method for manufacturing the capacitor comprises the steps of; providing a metallic foil; forming dielectrics on the metallic foil; forming a first electrode on a part of the dielectrics; forming a protective coating on a part of the metallic foil that includes the whole dielectrics; and etching the metallic foil to form a second electrode. PCOPYRIGHT: (C)2006,JPO&NCIPI