ALUMINUM SUBSTRATE FOR PRINTED CIRCUIT AND MANUFACTURING METHOD OF THE SUBSTRATE, AND PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an aluminum substrate for a printed circuit, in which an excellent oxidation film is formed and adhesion to a resin sheet is improved.;SOLUTION: The method includes a film formation step and a heating-and-drying step. In the film formation step, anodizing is performed to an aluminum sheet, in an electrolyte in which concentration of phosphoric acid is 3 to 20 mass%, and bath temperature is not lower than 25°C and less than 40°C, thereby an anodization film is formed on at least one surface. In the heating-and-drying step, heating is performed to the oxidation film at a temperature of 150 to 300°C for 0.5 to 3 hours.;COPYRIGHT: (C)2006,JPO&NCIPI