CATALYST SOLUTION FOR ELECTROLESS PLATING, AND METHOD FOR DEPOSITING ELECTROLESS-PLATED FILM

摘要

PROBLEM TO BE SOLVED: To provide a catalyst solution for electroless plating capable of depositing an electroless-plated film having excellent adhesiveness and smoothness by providing high catalyst activity on an inactive substrate, and a method for depositing an electroless-plated film.;SOLUTION: The catalyst solution is an aqueous solution containing palladium salt, and at least one organic acid selected from succinic acid, glutaric acid, adipic acid, acetic acid, propionic acid, and salt thereof.;COPYRIGHT: (C)2006,JPO&NCIPI