CATALYST SOLUTION USED IN ELECTROLESS PLATING METHOD, METHOD FOR PREPARING THE CATALYST SOLUTION, ELECTROLESS PLATING METHOD USING THE CATALYST SOLUTION, AND PLATED PRODUCT WITH METAL LAYER INCLUDING METALLIC FILM FORMED BY USING THE ELECTROLESS PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a catalyst solution which is used in an electroless plating method, the catalyst solution showing a good catalytic action and forming a copper catalyst nucleus which contains no metallic component such as palladium and tin having large specific resistance.;SOLUTION: In order to solve the problem, the catalyst solution, which contains cuprous ion, hypophosphorous acid ion and chlorine ion and whose pH is 6.0-8.5, is employed. In the catalyst solution, the hypophosphorous acid stabilizes the existence of the cuprous ion. Accordingly, when a material to be plated is treated with the catalyst solution, the cuprous ion is uniformly adsorbed on the surface of the material to be plated. The cuprous ion, which is adsorbed on the material to be plated, becomes a catalyst nucleus of metal copper, when it is subjected to reduction treatment, to show a good catalytic action to an electroless plating solution. Further, by using this catalyst solution, a metallic component is prevented from remaining on the surface of a base material posterior to wire processing as in the case that a palladium catalyst is used. Consequently, even if fine pitch wiring is formed, high insulation reliability is maintained.;COPYRIGHT: (C)2012,JPO&INPIT