CERAMIC GREEN SHEET LAMINATE FOR MULTI-CAVITY WIRING BOARD, MULTI-CAVITY WIRING BOARD, PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT AND METHOD FOR MANUFACTURING MULTI-CAVITY WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multi-cavity wiring board for reducing the possibility that position deviation is generated between insulating layers, a method for manufacturing the multi-cavity wiring board, a ceramic green sheet laminate, a package for housing an electronic component and electronic equipment.;SOLUTION: The ceramic green sheet laminate for a multi-cavity wiring board is configured of a laminate of a plurality of ceramic green sheets 101a to 101c in which a plurality of wiring board regions 109 are vertically and horizontally formed at the central section, and a dummy region 110 is formed at the outer peripheral section. A plurality of through-holes 111a to 111c whose diameters are different are formed so as to be continuously overlapped from the uppermost layer 111a to the lowermost layer 111c in the mutually press-fit upper and lower layer ceramic green sheets 101a to 101c in a dummy region 110 of each of the plurality of ceramic green sheets 101a to 101c.;COPYRIGHT: (C)2006,JPO&NCIPI