Multi-cavity wiring board, wiring board, and manufacturing method of multi-cavity wiring board

摘要

The multi-cavity wiring board has a first main surface and a second main surface opposite to the first main surface, and includes a mother board on which a plurality of wiring board regions are arranged. And a dividing groove provided on the first main surface and the second main surface along the boundary between the first dividing groove and the first dividing groove provided on the first main surface on one side of the wiring board region. A second divided groove provided on the second main surface so as to face the first divided groove, a third divided groove provided on the first main surface on the other side of the wiring board region, and a third divided groove And a fourth divided groove provided on the second main surface so as to be opposite to each other, and the depth of the first divided groove and the depth of the second divided groove are the same as the depth of the third divided groove and the second divided groove. There is a first curved portion that is provided larger than the depth of the four-divided groove and gradually increases in depth of the third divided groove toward the corner of the wiring board region. Of having a gradually larger second curving section provided.