The method of decreasing wafer arc discharge

摘要

SolutionsDuring etching processing the method of decreasing the damage of the wafer is disclosed. In one of many execution form, method, the step which at least allots respectively the bias voltage of one etching process and, allots one start ago of one etching process, at least and includes with the step which forms bias voltage. Method, furthermore, allots one start ago of one etching process, at least and includes the step which impresses bias voltage in the electrostatic chuck. Allotment bias voltage level decreases wafer arc discharge.