Die-bonding method of the LED chip

摘要

PROBLEM TO BE SOLVED: To allow high density die bonding with a plurality of LED chips cross to each other by die bonding the thinnest LED chip first out of a plurality of LED chips of different thickness. SOLUTION: To a base body 11, LED chips of different thickness are, through a bonding agent 13, die bonded in the order of thickness wherein the thinnest one first. In short, the thinner LED chip T1 is die bonded first, then the thicker LED chip T2 is die bonded. So, even if the thicker LED chip T2 is die bonded cross to the LED chip T1 die bonded already, since there exists height difference of Δh between the LED chips T1 and T2, the LED chip T1 is never touched with a die-bonder collet 12. Therefore, a plurality of LED chips are die bonded in high density. Further, since LED chips are die bonded cross to each other, mixture color of light emission is improved, and so, color variation and fluctuation in light emission characteristics are prevented.