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The stand for surface implementation, the surface implemental die LED lamp, it is adhesion being locked in one of production

机译:用于表面实施的支架,表面实施的LED灯,是生产粘接中的一种

摘要

PPROBLEM TO BE SOLVED: To provide a stand for surface mounting, which permits the surface mounting of an LED lamp on a printed circuit substrate and the mounting of the other component on the mounting surface and the rear surface of the printed circuit substrate, a surface-mounting LED lamp equipped with the stand for surface mounting, an LED unit equipped with the surface mounting type LED lamp, and the manufacturing method of the LED. PSOLUTION: The stand having an LED lamp unit 11, an engaging unit for engaging with the base unit of the LED lamp unit 11 and the stand 12 having a lead insertion unit 12b for inserting the lead 11a of the LED lamp unit 11 are provided. PCOPYRIGHT: (C)2004,JPO&NCIPI
机译:

要解决的问题:提供一种用于表面安装的支架,该支架允许将LED灯表面安装在印刷电路板上,并且可以将其他组件安装在印刷电路板的安装表面和背面上包括具有用于表面安装的支架的表面安装LED灯,具有表面安装型LED灯的LED单元以及LED的制造方法。

解决方案:具有LED灯单元11的支架,用于与LED灯单元11的基座单元接合的接合单元和具有引线插入单元12b的支架12用于插入LED灯单元11的引线11a。提供。

版权:(C)2004,日本特许厅和日本国家唱片公司

著录项

  • 公开/公告号JP3789434B2

    专利类型

  • 公开/公告日2006-06-21

    原文格式PDF

  • 申请/专利权人 星和電機株式会社;

    申请/专利号JP20030027250

  • 发明设计人 虫上 雅人;吉川 幸治;

    申请日2003-02-04

  • 分类号H01L33/00;

  • 国家 JP

  • 入库时间 2022-08-21 21:50:06

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