首页> 外国专利> The thermoplastic resin composition comprising a thermoplastic resin composite clay intercalation compound, the interlayer clay complex compounds and their preparation are

The thermoplastic resin composition comprising a thermoplastic resin composite clay intercalation compound, the interlayer clay complex compounds and their preparation are

机译:包含热塑性树脂复合粘土插层化合物,层间粘土复合化合物及其制备的热塑性树脂组合物是

摘要

PROBLEM TO BE SOLVED: To improve the rheological properties of a solvent by using a composite clay containing a surface-treating agent bonded to one or more lamellar silicates selected from smectite-group, vermiculite-group and kaolin-group clay minerals through covalent bond and having an average interlaminar thickness of smaller than a specific level in combination with a dispersion stabilizer. ;SOLUTION: This intercalation composite clay compound is composed of a composite clay containing 0.1-200 pts.wt. of a silanebased surface-treating agent bonded to 100 pts.wt. of one or more lamellar silicates selected from smectite-group, vermiculite-group and kaolin-group clay minerals through covalent bond and having an average interlaminar thickness of 200 in combination with 0.1-60 pts.wt. of a dispersion stabilizer. The dispersion stabilizer is e.g. a compound having polysiloxane chain as the main chain such as a silicone-based surfactant or a compound having polyether chain as the main chain such as polyethylene glycol. The objective thermoplastic resin composition is produced by compounding 100 pts.wt. of a thermoplastic resin such as polyamide resin or polycarbonate resin with 0.1-400 pts.wt. of the intercalation composite clay compound.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:通过使用含有表面处理剂的复合黏土来改善溶剂的流变性能,该黏土包含通过共价键键合和与分散稳定剂结合使用时,其平均层间厚度小于特定水平。 ;解决方案:该插层复合粘土化合物由含有0.1-200 pts.wt的复合粘土组成。结合至100 pts.wt.的硅烷基表面处理剂选自一种或多种通过共价键选自蒙脱石族,sm石族和高岭土族粘土矿物中的层状硅酸盐,其平均层间厚度为200,并结合0.1-60pts.wt。分散稳定剂。分散稳定剂例如为。具有聚硅氧烷链作为主链的化合物,例如硅氧烷基表面活性剂,或具有聚醚链作为主链的化合物,例如聚乙二醇。通过混合100pts.wt。生产目标热塑性树脂组合物。 0.1-400 pts.wt的热塑性树脂,例如聚酰胺树脂或聚碳酸酯树脂。插层复合粘土复合材料的研究。;版权所有:(C)1998,日本特许厅

著录项

  • 公开/公告号JP3767965B2

    专利类型

  • 公开/公告日2006-04-19

    原文格式PDF

  • 申请/专利权人 株式会社カネカ;

    申请/专利号JP19970066921

  • 发明设计人 鈴木 紀之;

    申请日1997-03-19

  • 分类号C01B33/44;C08K3/34;C08L71;C08L83/04;C08L101;

  • 国家 JP

  • 入库时间 2022-08-21 21:50:04

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