首页> 外国专利> Method to simultaneously form both fully silicided and partially silicided dual work function transistor gates during the manufacture of a semiconductor device, semiconductor devices, and systems including same

Method to simultaneously form both fully silicided and partially silicided dual work function transistor gates during the manufacture of a semiconductor device, semiconductor devices, and systems including same

机译:在半导体器件的制造过程中同时形成完全硅化和部分硅化的双功函数晶体管栅极的方法,半导体器件以及包括该栅极的系统

摘要

A method for forming transistor gates having two different work functions comprises forming a first polysilicon layer which may be doped with n-type dopants. The first polysilicon layer comprises an inhibitor material at select locations which retards silicide formation. A second polysilicon layer is formed over the first polysilicon layer. The first and second polysilicon layers are masked and etched to define transistor structures, some of which comprise the inhibitor and some which are free from the inhibitor. Dielectric spacers are formed, then a metal such as cobalt is deposited over the transistor structures. A thermal process may be used to react the metal with the transistor structures to form fully silicided gates from the inhibitor-free structures and partially silicided gates from the structures comprising the inhibitor. Fully silicided gates have the work function of a metal gate while partially silicided gates may have the work function of doped polysilicon.
机译:一种用于形成具有两个不同功函数的晶体管栅极的方法,包括形成可以掺杂有n型掺杂剂的第一多晶硅层。第一多晶硅层在选择的位置处包括阻止硅化物形成的抑制剂材料。在第一多晶硅层上方形成第二多晶硅层。掩蔽和蚀刻第一和第二多晶硅层以限定晶体管结构,其中一些包含抑制剂,而一些不含抑制剂。形成电介质间隔物,然后在晶体管结构上沉积诸如钴的金属。可以使用热处理使金属与晶体管结构反应,以从无抑制剂的结构形成完全硅化的栅极,并从包含抑制剂的结构形成部分硅化的栅极。完全硅化的栅极具有金属栅极的功函,而部分硅化的栅极可以具有掺杂的多晶硅的功函。

著录项

  • 公开/公告号US2006205133A1

    专利类型

  • 公开/公告日2006-09-14

    原文格式PDF

  • 申请/专利权人 JIGISH D. TRIVEDI;SURAJ MATHEW;

    申请/专利号US20050076497

  • 发明设计人 SURAJ MATHEW;JIGISH D. TRIVEDI;

    申请日2005-03-08

  • 分类号H01L21/8238;H01L21/3205;H01L21/4763;H01L21/8234;

  • 国家 US

  • 入库时间 2022-08-21 21:48:00

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