Three dimensional package type stacking for thinner package application

摘要

A stacked semiconductor device, and method of making, having a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a first substrate. Solder balls are connected to contacts on the upper surface of the first substrate and a non-conductive layer is provided overlaying the first substrate and the first semiconductor chip. The solder balls are secured in cavities formed in the layer and extend beyond the top surface of the layer. A second semiconductor chip mounted on a second substrate is stacked on the layer with contacts on the lower surface of the second substrate in electrical contact with the extended portion of the solder balls, thereby connecting the second semiconductor chip with the first semiconductor chip.