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Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester
Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester
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机译:使用自动测试仪上的多个受控塌陷芯片连接电流测量来确定I DDQ Sub>缺陷的方法
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摘要
A method for improving the signal-to-noise ratio in an IDDQ defect test is disclosed. An integrated circuit is divided into a plurality of areas and each area is provided with and bounded by terminals. An IDDQ defect is activated to generate IDDQ defect current within the integrated circuit. An amount of IDDQ defect current generated within each area is measured at the terminals provided thereto. Based on the IDDQ current measurement on each area, an IDDQ current map is created. By analyzing the IDDQ current map, the presence and location of the defect is determined. Based on the determination, the IDDQ defect is isolated.
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