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Apparatus and method for high speed scan for detection and measurement of properties of sub-wavelength defects and artifacts in semiconductor and mask metrology
Apparatus and method for high speed scan for detection and measurement of properties of sub-wavelength defects and artifacts in semiconductor and mask metrology
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机译:用于半导体和掩模计量学中亚波长缺陷和伪像的特性的检测和测量的高速扫描装置和方法
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摘要
A method of detecting defects or artifacts on or in an object, wherein the defects or artifacts are characterized by a characteristic dimension, the method involving: generating an input beam for illuminating a spot at a selected location on or in the object, wherein the spot has a size L that is substantially larger than the characteristic dimension; deriving a measurement beam and a reference beam from the input beam; directing the measurement beam onto the object as an incident measurement beam that illuminates the spot at that selected location on or in the object to produce a backscattered measurement beam; interfering the backscattered measurement beam with the reference beam to produce an interference beam, the reference beam being oriented relative to the backscattered measurement beam so as to produce a peak sensitivity for a portion of the backscattered measurement beam that emanates from the object at a predetermined diffraction angle; converting the interference beam for that selected location into an interference signal; and using the interference signal for that selected location to determine whether any defects or artifacts characterized by said characteristic dimension are present anywhere within a region on or in the object defined by the spot at that selected location.
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