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Even nucleation between silicon and oxide surfaces for thin silicon nitride film growth

机译:硅和氧化物表面之间均匀成核,从而形成氮化硅薄膜

摘要

A semiconductor assembly providing even nucleation between silicon and oxide surfaces for growing uniformly thin silicon nitride layers used in semiconductor devices is disclosed. First, a nonconductive nitride-nucleation enhancing monolayer is formed over a semiconductor assembly having both nitridation receptive and resistive materials. For purposes of the present invention, a nitride-nucleation enhancing monolayer is a material that will readily accept the bonding of nitrogen atoms to the material itself. Next, a silicon nitride layer is formed over the nonconductive nitride-nucleation enhancing monolayer. The nonconductive nitride-nucleation enhancing monolayer provides even nucleation over both the nitridation receptive material and the nitridation resistive material for silicon nitride, thereby allowing for the growth of a uniformly thin nitride layer.
机译:公开了一种半导体组件,其在硅和氧化物表面之间提供均匀的成核,以生长用于半导体器件中的均匀薄的氮化硅层。首先,在同时具有氮化材料和电阻材料的半导体组件上形成非导电氮化物成核增强单层。为了本发明的目的,氮化物成核增强单层是将容易接受氮原子与材料本身结合的材料。接下来,在非导电氮化物成核增强单层上形成氮化硅层。非导电氮化物成核增强单层在氮化硅的氮化接受材料和抗氮化材料两者上提供均匀的成核,从而允许生长均匀薄的氮化物层。

著录项

  • 公开/公告号US2005269649A1

    专利类型

  • 公开/公告日2005-12-08

    原文格式PDF

  • 申请/专利权人 ER-XUAN PING;

    申请/专利号US20050199471

  • 发明设计人 ER-XUAN PING;

    申请日2005-08-08

  • 分类号H01L29/76;

  • 国家 US

  • 入库时间 2022-08-21 21:42:24

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