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Heat exchanger, substrate, and process for depositing a layer of amorphous carbon on a substrate.

机译:热交换器,衬底以及用于在衬底上沉积非晶碳层的方法。

摘要

"Heat exchanger, substrate, and process for depositing a layer of amorphous carbon on a substrate.Process for the deposition of a layer of amorphous carbon substrates, such as heat exchangers, and coated substrates formed as a heat exchanger of thin aluminum.The heat exchanger includes a heat sink having deposited on its surface is extended.A layer of a coating of amorphous carbon (DLC) having a hardness of at least 2000kg / mmu00ac 2u00ac, a specific resistivity of at least 10u00ac 8u00ac ohm cm.And a dielectric strength of at least 10u00ac 6u00ac V / cm.
机译:热交换器,基底和在基底上沉积无定形碳层的方法。沉积无定形碳基底的层的方法,例如热交换器和形成为薄铝的热交换器的涂覆基底。热交换器包括一个在其表面上沉积有散热器的散热器。一层非晶碳(DLC)涂层,其硬度至少为2000kg / mm 2,比电阻至少为10ac 8欧·欧姆·厘米,介电强度至少10欧·6欧/厘米。

著录项

  • 公开/公告号BRPI0409103A

    专利类型

  • 公开/公告日2006-04-04

    原文格式PDF

  • 申请/专利权人 PRAXAIR S.T. TECHNOLOGY INC.;

    申请/专利号BR2004PI09103

  • 发明设计人 MICHAEL WILLIAM BRADLEY;

    申请日2004-04-08

  • 分类号C23C16/26;C23C16/509;F28F13/18;

  • 国家 BR

  • 入库时间 2022-08-21 21:40:09

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