METHOD AND APPARATUS FOR IMPROVING DEFECTIVE SOLDER JOINT DETECTION USING X-RAY INSPECTION OF PRINTED ASSEMBLIES

摘要

ABSTRACT OF THE DISCLOSUREMETHOD AND APPARATUS FOR IMPROVING DEFECTIVE SOLDER JOINT DETECTION USING X-RAY INSPECTION OF PRINTED ASSEMBLIESAn assembly and method for detecting defective and open solder joints of an area array packages attached to a printed circuit assembly ispresented. The assembly employs offset pad layout on either or both of the printed.circuit assembly or the area array package allowing unproved solder joint defect detection.Fig. 15