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ETCHANT FOR WET ETCHING AlXGaI-XAs EPITAXIAL LAYER AND METHOD FOR MANUFACTURING SEMI¬ CONDUCTOR DEVICE USING THE ETCHANT
ETCHANT FOR WET ETCHING AlXGaI-XAs EPITAXIAL LAYER AND METHOD FOR MANUFACTURING SEMI¬ CONDUCTOR DEVICE USING THE ETCHANT
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机译:用于湿法刻蚀的AlXGaI-XAs外延层的刻蚀剂以及使用该刻蚀剂制造半导体器件的方法
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摘要
Provided are an etchant for etching an Alx Ga1-x As epitaxial layer and a method of fabricating semiconductor devices using the same. The etchant includes a mixture of H3 PO4 , H2O2, and CH3OH. Using the etchant, an Alx Ga1-x As (O x 1) epitaxial layer is etched, thereby providing isotropic etching characteristics and forming a mesa with vertical sidewalls. Since the etch selectivity of the GaAs layer and the AlGaAs layer is close to 1, the sidewalls of the mesa are smooth.
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机译:提供一种用于蚀刻Al x Ga 1-x As外延层的蚀刻剂以及使用该蚀刻剂的半导体器件的制造方法。蚀刻剂包括H 3 PO 4,H 2 O 2和CH 3 OH的混合物。使用该蚀刻剂,蚀刻Al x Ga 1-x As(O 展开▼