首页> 外国专利> CONTROL OF PHOTOELECTROCHEMICAL (PEC) ETCHING BY MODIFICATION OF THE LOCAL ELECTROCHEMICAL POTENTIAL OF THE SEMICONDUCTOR STRUCTURE RELATIVE TO THE ELECTROLYTE

CONTROL OF PHOTOELECTROCHEMICAL (PEC) ETCHING BY MODIFICATION OF THE LOCAL ELECTROCHEMICAL POTENTIAL OF THE SEMICONDUCTOR STRUCTURE RELATIVE TO THE ELECTROLYTE

机译:通过修饰与电解质有关的半导电结构的局部电势来控制光电子(PEC)蚀刻

摘要

A method for locally controlling an electrical potential of a semiconductor structure or device, and hence locally controlling lateral and/or vertical photoelectrochemical (PEC) etch rates, by appropriate placement of electrically resistive layers or layers that impede electron flow within the semiconductor structure, and/or by positioning a cathode in contact with specific layers of the semiconductor structure during PEC etching.
机译:一种通过适当地放置阻碍电子流在半导体结构内的电阻层或电阻层来局部控制半导体结构或器件的电势,从而局部控制横向和/或垂直光电化学(PEC)蚀刻速率的方法,以及/或通过在PEC蚀刻过程中将阴极放置在与半导体结构的特定层接触的位置。

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