首页> 外国专利> CONTROLLED GROWTH OF HIGHLY UNIFORM, OXIDE LAYERS, ESPECIALLY ULTRATHIN LAYERS

CONTROLLED GROWTH OF HIGHLY UNIFORM, OXIDE LAYERS, ESPECIALLY ULTRATHIN LAYERS

机译:高度均匀的氧化物层(尤其是超薄层)的受控生长

摘要

The present invention relates to methods of making oxide layers, preferably ultrathin oxide layers, with a high level of uniformity. One such method includes the steps of forming a substantially saturated or saturated oxide layer directly or indirectly on a semiconductor surface of a semiconductor substrate, and etchingly reducing the thickness of the substantially saturated or saturated oxide layer by an amount such that the etched oxide layer has a thickness less than the substantially saturated or saturated oxide layer. In certain embodiments, methods of the present invention provide etched oxide layers with a uniformity of less than about +/-10%. The present invention also relates to microelectronic devices including made by methods of the present invention and manufacturing systems for carrying out methods of the present invention.
机译:本发明涉及制备具有高均匀度的氧化物层,优选超薄氧化物层的方法。一种这样的方法包括以下步骤:直接或间接地在半导体衬底的半导体表面上形成基本上饱和或饱和的氧化物层;以及以使蚀刻后的氧化物层具有一定量的量,蚀刻地减小基本上饱和或饱和的氧化物层的厚度。厚度小于基本上饱和或饱和的氧化物层。在某些实施例中,本发明的方法提供具有小于约+/- 10%的均匀性的蚀刻氧化物层。本发明还涉及包括通过本发明的方法制造的微电子器件以及用于执行本发明的方法的制造系统。

著录项

  • 公开/公告号EP1652224A2

    专利类型

  • 公开/公告日2006-05-03

    原文格式PDF

  • 申请/专利权人 FSI INTERNATIONAL INC.;

    申请/专利号EP20040779229

  • 发明设计人 WAGENER THOMAS J.;

    申请日2004-07-28

  • 分类号H01L21/316;H01L21/00;H01L21/28;H01L21/311;H01L21/66;

  • 国家 EP

  • 入库时间 2022-08-21 21:28:17

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