BONDING COORDINATION CONVERTING METHOD OF WIRE BONDER FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND STORAGE MEDIA STORED IT

摘要

The present invention relates to a method of converting the bonding coordinates of a wire bonder for manufacturing a semiconductor package and a recording medium on which a program for implementing the same is recorded. When the wire bonding coordinates are manually input from one wire bonder, the other wire bonder is used separately. Since the input wire bonding coordinates can be converted and used without the manual wire bonding coordinates input, the first wire bonding coordinates file input from one wire bonder can be greatly reduced so that the setup time of the heterogeneous wire bonder can be greatly reduced. Selecting one of a plurality of different wire bonders to use in the loaded wire, and a different type of wire bonder to use the loaded first wire bonding coordinate file, and the selected one of the heterogeneous wire bond coordinate files. Second wire bonding for use in wire bonders And converting the coordinate file into a coordinate file, and storing the converted second wire bonding coordinate file.