WIRE BONDER WHEREIN BONDING PARAMETERS ARE AUTOMATICALLY SETTED

摘要

The wire bonder according to the present invention includes an input unit and a control unit. Input values of the set target ball diameter and target ball height are input. The control unit stores the values of the initial ball-diameter and the impact force suitable for the values of the target ball-diameter and the target ball-height so that the initial ball-diameter corresponding to the set target ball-diameter and the target ball-height values from the input unit. And wire bonding control with values of impact force.