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Wire bonder wherein bonding parameters are automatically setted
Wire bonder wherein bonding parameters are automatically setted
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机译:自动设定焊接参数的焊线机
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摘要
The wire bonder according to the present invention includes an input unit and a control unit. Input values of the set target ball diameter and target ball height are input. The control unit stores the values of the initial ball-diameter and the impact force suitable for the values of the target ball-diameter and the target ball-height so that the initial ball-diameter corresponding to the set target ball-diameter and the target ball-height values from the input unit. And wire bonding control with values of impact force.
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