Exposure method and reticle, reticle assembly and exposure apparatus for performing the same

摘要

In the exposure process for transferring an image on the wafer, the first exposure step for the plurality of shot areas including at least one die area is set on the wafer, respectively are performed using the illumination light passing through the reticle, second exposure process for die area that borders the edge region of the wafer is performed by the illuminating light passing through the light transmitting member which is disposed adjacent to the reticle. The light-transmitting member includes a light transmission region of the rectangular ribbon shape for passing the illumination light, the wafer moves the illumination light passing through the light transmission region to scan the die area that borders the edge region of the wafer .