WARPAGE FREE SEMICONDUCTOR CHIP PACKAGE DIE ATTACH METHOD

摘要

The invention vacuum wafer chuck and the wafer is placed (chuck) and the wafer chuck attached to the upper surface The extreme pending tape (expanding tape), and a semiconductor for removing sebum Words using the semiconductor die-attach device having a collet for sucking a semiconductor die fixed to one side of the transfer head (collet) and collet (transfer head) as a die-attach method for chip packages, the extreme pending on the mounting wafer on the tape, the individual pre-cut spacers stiffness (stiffness) comprises a large sheet and the adhesive layer (adhesive layer) comprising the steps of pressing the wafer, the the spacer is attached to the wafer with a plurality of die-separated (dicing) step of the spacer is attached to the removed die Wars sebum pickup (pick-up) to stage, and is attached to the spacer Wars sebum is removed that the die comprises a step of attaching on the substrate (substrate) is characterized. Accordingly, it is possible to compensate for the individual dies of a die-attach Wars sebum may improve the productivity can be omitted and the dispensing process to prevent cracking of the thin die.