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Die attaching method of semiconductor chip using warpage prevention material
Die attaching method of semiconductor chip using warpage prevention material
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机译:使用防翘曲材料的半导体芯片的芯片固定方法
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摘要
A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.
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