EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR PACKAGE HAVING LOW DIELECTRIC CONSTANT AND SIMICONDUCTOR PACKAGE USING THE SAME

摘要

is an epoxy molding compound for a semiconductor package according to the present invention comprises a makin filler , resin and additives , in particular the filling material comprises a filling material having a lower dielectric constant than silica , silica . According to this invention , the dielectric constant of the epoxy molding compound is reduced, and thus the interconnection delay it is possible to improve the operating characteristics of the device it is possible to reduce the signal delay due to the reduction .