THERMALLY CONDUCTIVE POLYIMIDE FILM COMPOSITES HAVING HIGH THERMAL CONDUCTIVITY USEFUL IN AN ELECTRONIC DEVICE

摘要

In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles at a weight percent between 40 and 85 % weight percent. These film composites have good dielectric strength, good thermal conductivity, and optionally good adhesivity.