A METHOD FOR DISPERSING HEAT IN THE BGA PACKAGE AND A BGA PACKAGE WITH A HEAT EMITTING ROD

摘要

This invention relates to a BGA package including the heat sink and the heat dissipating rods method of the BGA package, Specifically, a method of radiating heat by installing a heat dissipating rods between the molding of a package top surface and to a heat sink rod is installed on the BGA package. Heat dissipation process according to the invention is such that the heat dissipating rods made of at least one post on a substrate of a BGA package type, the heat dissipating rods the cross-sectional area in the lower part and the upper part than the cross-sectional area of the columnar portion corresponding to the middle part larger, and is characterized in that the thermal conductivity of the material of the heat dissipation rate of the heat rod is large than the other part of the BGA package, the heat generated from the BGA substrate of the package or ball is discharged to the outside through the heat sink rod. Heat radiation method of the BGA package according to the present invention is to be able to efficiently release the heat generated within the package with a simple structure to the outside. In addition, it is possible to minimize the impact on the weight and size of the BGA package due to the simple structure, as well as to enable efficient heat dissipation by properly controlling the number of heat-dissipating rods, depending on the application of the BGA package.