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SEMICONDUCTOR STRUCTURE WITH DIFFERENT LATTICE CONSTANT MATERIALS AND METHOD FOR FORMING THE SAME

机译:具有不同晶格常数材料的半导体结构及其形成方法

摘要

A semiconductor structure (10) includes a substrate comprising a first relaxed semiconductor material with a first lattice constant. A semiconductor device layer (34) overlies the substrate, wherein the semiconductor device layer includes a second relaxed semiconductor material (22) with a second lattice constant different from the first lattice constant. In addition, a dielectric layer is interposed between the substrate and the semiconductor device layer, wherein the dielectric layer is interposed between the substrate and the semiconductor device layer, wherein the dielectric layer includes a programmed transition zone disposed within the dielectric layer for transitioning between the first lattice constant and the second lattice constant. The programmed transition zone includes a plurality of layers, adjoining ones of the plurality of layers having different lattice constants with one of the adjoining ones having a first thickness exceeding a first critical thickness required to form defects and another of the adjoining ones having a second thickness not exceeding a second critical thickness. Each adjoining layer of the plurality of layers forms an interface for promoting defects in the transition zone to migrate to and terminate on an edge of the programmed transition zone. A method of making the same is also enclosed.
机译:半导体结构(10)包括衬底,该衬底包括具有第一晶格常数的第一松弛半导体材料。半导体器件层(34)覆盖衬底,其中半导体器件层包括具有第二晶格常数不同于第一晶格常数的第二松弛半导体材料(22)。另外,介电层插入在衬底与半导体器件层之间,其中介电层插入在衬底与半导体器件层之间,其中介电层包括设置在介电层内的编程过渡区,用于在衬底之间进行过渡。第一晶格常数和第二晶格常数。所述程序化过渡区包括多个层,所述多个层中的相邻层具有不同的晶格常数,其中一个相邻的层具有超过形成缺陷所需的第一临界厚度的第一厚度,而另一个相邻的层具有第二厚度。不超过第二临界厚度。多个层中的每个邻接层形成界面,以促进过渡区中的缺陷迁移并终止于编程的过渡区的边缘。还包括一种制造方法。

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