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PAD CONDITIONER FOR IMPROVING REMOVAL RATE AND ROUGHNESS OF POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS USING THE SAME
PAD CONDITIONER FOR IMPROVING REMOVAL RATE AND ROUGHNESS OF POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS USING THE SAME
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机译:用于提高抛光垫去除率和粗糙度的抛光垫调节器以及使用该抛光垫的化学机械抛光装置
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摘要
A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.
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