首页> 外国专利> METHOD OF MANUFACTURING A DIELECTRIC FILM AND METHOD OF MANUFACTURING METAL INSULATOR METAL CAPACITOR HAVING THE DIELECTRIC FILM AND BATCH TYPE ATOMIC LAYER DEPOSITION APPARATUS FOR MANUFACTURING THE DIELECTRIC FILM

METHOD OF MANUFACTURING A DIELECTRIC FILM AND METHOD OF MANUFACTURING METAL INSULATOR METAL CAPACITOR HAVING THE DIELECTRIC FILM AND BATCH TYPE ATOMIC LAYER DEPOSITION APPARATUS FOR MANUFACTURING THE DIELECTRIC FILM

机译:具有介电膜和用于制造介电膜的间歇式原子层沉积装置的介电膜的制造方法和金属绝缘体金属电容器的制造方法

摘要

The present invention provides the methods of manufacture dielectric film, including forming the first dielectric film on a chip, atomic layer deposition (ALD) is used in a first batch of types of devices, an auxiliary queue film is formed on the first dielectric film, atomic layer deposition is used in a second batch types of devices, wherein auxiliary queue film has a higher crystallization temperature than the first dielectric film and forms third dielectric film on auxiliary queue film, and atomic layer deposition is used in third batch-type apparatus. The method of manufacture metal-insulator-metal (MIM) capacitor of application method is additionally provided, dielectric film is formed and batch-type apparatus for atomic layer deposition is used to form dielectric film.
机译:本发明提供了制造介电膜的方法,包括在芯片上形成第一介电膜,在第一批类型的器件中使用原子层沉积(ALD),在第一介电膜上形成辅助队列膜,在第二批类型的装置中使用原子层沉积,其中辅助队列膜的结晶温度高于第一介电膜并在辅助队列膜上形成第三电介质膜,并且在第三批类型的装置中使用原子层沉积。另外,提供了应用方法的金属-绝缘-金属(MIM)电容器的制造方法,形成电介质膜,并使用用于原子层沉积的间歇式装置形成电介质膜。

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