Thin-type printed circuit board for manufacturing chip scale package

摘要

This invention relates to a thin printed circuit board for a chip scale package manufacture . The present invention provides a thin printed circuit board for a semiconductor chip is surrounded by the circuit patterns and the circuit pattern is attached to chip scale package manufacturing a printed circuit board unit that is composed of a substrate are arranged side by side in the horizontal direction , the unit of the printed circuit board the boundary between the at least one slot formed long in the vertical direction is formed in the upper and lower parts of the boundary portion and the circuit pattern is disposed as spaced in the transverse direction longer than the perimeter of the intersection and the longitudinal direction the deflection is prevented by including portions for molding the plurality of support are made using a mold .