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Method of manufacturing a semiconductor wafer using a method for measuring the contamination on the semiconductor wafer and contamination monitoring device and in-line
Method of manufacturing a semiconductor wafer using a method for measuring the contamination on the semiconductor wafer and contamination monitoring device and in-line
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机译:使用用于测量半导体晶片上的污染的方法和污染监测装置的在线制造半导体晶片的方法
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摘要
A method and apparatus for detecting copper (Cu) contamination on the backside of a wafer (120) begins by providing the wafer (120). The wafer (120) is rotated about a rotational axis via a motor/computer controlled wafer stage (118). In addition to rotation of the wafer (120), motor/computer control of a monochromator (116) is used to raster scan an X-ray beam (114b) across a surface of the rotating wafer (120). A plurality of X-ray detectors (122) are arrayed in one or more rows in close proximity to the scanned surface of the semiconductor wafer (120). The detectors (122), detect X-ray fluorescence emission from the surface of the wafer (120) whereby copper contamination of the wafer (120) can be determined in an accurate and time efficient manner which enables contamination detection in-line with normal wafer processing.
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