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multi-layer structure of the external electrode having a low-temperature co-fired ceramic (LTCC) package

机译:低温共烧陶瓷(LTCC)封装的外部电极的多层结构

摘要

The present invention is forming a surface electrode on a ceramic substrate using a low temperature co-fired ceramic (LTCC) technology relates to a technique for. ; LTCC package according to the present invention, a ceramic substrate containing a glass; And the low-temperature co-fired, and using the method comprises a first and second metal electrodes formed by a plurality of metal layers on the surface of the substrate, the first electrode is a metal paste having a predetermined firing temperature on the ceramic substrate, is formed by the second metal electrode is characterized to be formed by using a paste having a lower sintering temperature than said predetermined firing temperature on the first metallic electrode. Metal electrodes may also be formed of the multilayer structure by using a paste having a powder of a paste or of different sizes each layer has a different firing temperature. ; by reducing the amount of glass in the LTCC package eluted by low temperature co-fired external electrode surface according to the present invention can improve the plating properties and the ability to form a closed structure of the LTCC package external electrodes, LTCC package using a part of the downsizing, lower cost, lighter weight, function is advantageous to improve the integration capacity.
机译:本发明涉及使用低温共烧陶瓷(LTCC)技术在陶瓷基板上形成表面电极的技术。 ;根据本发明的LTCC封装,其包含玻璃的陶瓷基板;并且低温共烧,并且使用该方法包括由第一金属电极和第二金属电极在基板表面上形成的多个金属层,第一电极是在陶瓷基板上具有预定烧成温度的金属膏由第二金属电极形成的硅化物的特征在于,通过在第一金属电极上使用具有比所述预定烧成温度低的烧结温度的糊剂来形成。金属电极也可以通过使用具有糊状粉末或具有不同大小的粉末的糊状物由多层结构形成,每层具有不同的烧成温度。 ;通过减少根据本发明的低温共烧外部电极表面洗脱的LTCC封装中的玻璃量,可以提高LTCC封装外部电极的电镀性能和形成封闭结构的能力,LTCC封装使用了一部分小型化,低成本,轻量化的功能有利于提高集成能力。

著录项

  • 公开/公告号KR100593897B1

    专利类型

  • 公开/公告日2006-06-28

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040013477

  • 发明设计人 장재혁;

    申请日2004-02-27

  • 分类号H01L23/15;

  • 国家 KR

  • 入库时间 2022-08-21 21:23:35

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