A method for the production of micro-electromechanical systems (microelectromechanical systems: mems) by means of silicon fusion bonding - high temperature -

摘要

A method for manufacturing microelectromechanical sensors (mems), in which the sensors, and the sensor signal processing electronics be executed monolithically integrated, in that a cavities containing first silicon wafer (cavities disk) with a second component wafer by bonding and then is thinned, characterized by the following procedure:– Use of a component wafer with a the subsequent components supporting high-impedance epitaxial layer that the same conductivity type as the cavities and disk has already structures of electronic circuits on the side which faces according to the connection of the cavity is.– High temperature - fusion bonding of the component wafer with the side of the epitaxial layer as a connection side to the cavities disc without a different type of intermediate layer between the two disks.– Thinning of the disks dressing on the side of the component wafer to the full elimination of the not by the epitaxial layer portion is formed of this disc, i.e, up to the the micromechanical part of the sensor or thickness of any other appropriate thickness of the membrane to a mechanical stress sensitive part of the epitaxial layer by means of mechanical abrasion..