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Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers
Production of microelectromechanical systems (MEMS) using the high-temperature silicon fusion bonding of wafers
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机译:利用晶片的高温硅熔合生产微机电系统(MEMS)
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摘要
The invention relates to a method for producing a microelectromechanical system (MEMS) which comprises a sensor and CMOS technology-based electronics for processing the sensor signal, both being monolithically integrated in said system. To fulfil the pre-requisites for producing the electronic part (4) of the sensor (5) and the signal processing electronics using CMOS technology, a semiconductor wafer (2) containing a depression is bonded to a wafer with an epitaxial layer by means of said layer (3) using high-temperature fusion bonding, to form a double wafer and material is subsequently removed from one face of the double wafer. The latter is then polished until the epitaxial layer is exposed, thus creating a membrane (3a).
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