Re-wiring device for electronic component, has conducting paths arranged in two sections, which run in respective planes arranged over one another, where planes are insulated form each other and lengths of sections are same

摘要

The device has a set of conducting paths connecting bond-pads with respective contact surfaces on a round end of a bump. The paths are arranged in two electrically connected sections (5, 8), where the section (5) runs in a plane starting from the bond-pads and the section (8) runs in another plane arranged over the former plane. The planes are electrically insulated form each other, where the lengths of the sections are same.