Contact surfaces e.g. cooling unit, connecting device, has contact surfaces connected by solidifying liquid e.g. melted solder, such that section of one of two surface edges exhibits structuring in area of edges

摘要

The device has two contact surfaces connected by a solidifying liquid e.g. melted solder, such that a section of one of the surface edges (B1, B2) exhibits a structuring in an area of the surface edges. A radius of curvature (R2) of the structuring is formed proportional to a thickness of the liquid. The surfaces are provided for transmitting electrical signals and for mechanical connection between supports. An independent claim is also included for a method for connecting contact surfaces.